TriboLab CMP

TriboLab CMP

0.00

Leveraging over 20 years of CMP characterization expertise with its predecessor product (Bruker CP-4), TriboLab CMP brings a complete set of capabilities to the industry-leading TriboLab platform. The resulting accuracy and measurement repeatability enables the highly effective qualification, inspection, and ongoing functionality testing required throughout the CMP process. TriboLab CMP is the only process development tool on the market that can provide a broad range of polishing pressure (0.05-50 psi), speeds (1 to 500 rpm), friction, acoustic emissions, and surface temperature measurements for accurate and complete characterization of CMP processes and consumables.

Categories: Chemical Mechanical Polishing, Semiconductor Solutions

Description

The Bruker TriboLab CMP Process and Material Characterization System is a compact benchtop tool engineered to accurately replicate full-scale wafer polishing conditions without any downtime on production equipment. It offers exceptional ROI by enabling testing on small samples instead of full wafers, reducing operational costs while accelerating materials development and process refinement.

The system features flexible CMP parameter control to support tailored experimentation with high accuracy and repeatability. Its on-board diagnostics provide unmatched visibility into transient polishing behavior by capturing detailed data from initial pad contact through the entire test. This enables informed, early-stage process development decisions.

TriboLab CMP supports a wide range of sample types, materials, slurries, pads, and conditioning discs. It accommodates small coupons through full 100 mm wafers and provides multiple mounting configurations for enhanced flexibility. Backed by Bruker’s extensive expertise and global install base, users benefit from strong applications support and guidance.

TriboLab CMP — Summary Table

Category Key Details
Primary Benefit High ROI benchtop CMP system that replicates full-scale wafer polishing without production downtime
Purpose CMP process and material characterization for R&D and early-stage development
Cost Savings Allows testing on small coupons, significantly reducing cost compared to full-wafer tests
Repeatability & Detail Delivers highly repeatable, detailed polishing process measurements
On-Board Diagnostics Provides full visibility into transient polishing behavior from first pad contact through the test duration
Data Insight Enables early process decisions with complete, high-resolution diagnostic data
Parameter Control Highly flexible CMP parameter control for tailored testing and optimization
Sample & Material Flexibility Compatible with any flat material, slurry, pad, and conditioning disc
Sample Size Range Supports small coupons up to full 100 mm wafers
Mounting Options Multiple sample mounting configurations available for different testing needs
Applications Expertise Backed by Bruker’s global install base and expert applications support
Ideal Users CMP researchers, process engineers, semiconductor R&D teams, material scientists


Related Products

  • Hysitron TS 75 TriboScope
  • Hysitron IntraSpect 360
  • Hysitron IntraSpect 90
  • Hysitron BioSoft