Hysitron TS 75 TriboScope

Hysitron TS 75 TriboScope

0.00

The Hysitron TS 75 TriboScope delivers quantitative, rigid-probe nanoindentation and nanotribological characterization capabilities to Bruker’s world-leading atomic force microscopes. The Hysitron TriboScope interfaces with select Dimension and MultiMode AFMs to expand the characterization capabilities of these microscopes. By utilizing a rigid test probe, the TriboScope removes the intrinsic limitations, variability, and complexity associated with cantilever-based measurements to deliver quantitative and repeatable mechanical and tribological characterization over nanometer-to-micrometer length scales.

Categories: Nanomechanical Metrology Tools, Semiconductor Solutions

Description

Feature Description
Quantitative Rigid-Probe Characterization Eliminates uncertainties from cantilever-based nanoindentation, providing direct force and displacement measurements.
Capacitive Transducer Technology Proprietary transducer delivers superior control over nanoindentation with industry-leading force and displacement noise floors.
Mechanical Interface Intuitive design streamlines integration with select Bruker Dimension and MultiMode AFMs.
Testing Modes Quasi-Static Nanoindentation: Characterizes mechanical properties of small material volumes.
ScanningWear: Measures wear resistance at the nanoscale.
Rigid-Probe Advantage Directly measures material response without interference from cantilever flexural or rotational stiffness.
Electrostatic Force Actuation Proprietary actuation and capacitive displacement sensing achieve ultra-low noise and low thermal drift for nanoscale characterization.
Force and Displacement Feedback Control Closed-loop control at 78 kHz loop rate enables rapid response to material deformation and precise reproduction of operator-defined test functions.
Upgrade Options Hysitron BioSoft can be configured with additional modules to expand capabilities for current and future research needs.
Applications High-throughput material screening with nanoDMA III for thin films and transparent conducting oxides; monitoring hardness, modulus, and wear depth of thin hard coatings on steel.

Related Products

  • Hysitron IntraSpect 360
  • Hysitron IntraSpect 90
  • Hysitron BioSoft
  • Placeholder