InSight 300 is a fab-ready automated atomic force microscope (AAFM) designed for reliable, cost-effective inline metrology in high-volume semiconductor manufacturing environments. With <±1nm scanner flatness and a best-in-class noise floor of <35pm, this system meets the rigorous requirements of advanced CMP and etch applications, from micron-roughness to fully automated bare-wafer defect review. Its profilometry capabilities meet and exceed the millimeter-scale and bevel-edge metrology requirements for cutting-edge hybrid bonding applications. InSight 300 also features Bruker-proprietary operating modes for optimized measurements of sidewall roughness, automatic bare-wafer defect review, and advanced profiling of feature surfaces.
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InSight AFP is the world’s highest performance and industry preferred CMP profiling and etch depth metrology system for advanced technology nodes. The combination of its modern tip scanner with inherently stable capacitive gauges and an accurate air-bearing positioning system enables non-destructive, direct measurements in the active area of dies.
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