Description
The Bruker InSight AFP is an advanced atomic force profiler designed for fully automated, inline process control of etchand CMP wafers. With TrueSense® technology, it delivers the highest-resolution surface measurements and exceptional tip life,while enabling accurate monitoring of etch depth, dishing, and erosion on submicron features without reliance on test keys or modeling.
The system integrates CDMode for high-accuracy sidewall roughness and profile characterization, significantly reducing the need for cross-sectioning and providing direct sidewall measurements that are not accessible through other techniques.
InSight AFP further provides automated defect review and classification, offering rapid, actionable topographical and material information to support high-volume manufacturing. With high-accuracy placement enabled by 100x optics and AFM Global Alignment,
the system ensures less than ±250 nm placement accuracy and is fully compatible with KLARITY and most YMS platforms.
High-speed 3D die mapping and HyperMap™ allow fast, full-field post-CMP inspection with automatic hotspot detection and rescan capability. Profiling speeds up to 36,000 µm/sec support comprehensive full reticle field characterization.
Key application areas include CMP advanced process control, etch depth metrology, logic and memory process development, NAND and power device metrology, EUV lithography APC, and EUV resist development. With picometer-level sensitivity, low TMU, and flexible
recipe creation, the InSight AFP is optimized for both HVM and R&D environments.
InSight AFP — Summary Table
| Category | Key Details |
|---|---|
| Primary Function | Fully automated AFM/AFP metrology for CMP and etch process control |
| Core Technology | TrueSense® for highest resolution and long tip life; atomic force profiler for submicron metrology |
| Inline Process Control | Automated measurement of etch depth, dishing, and erosion without test keys or modeling |
| Sidewall & Etch Profiling | CDMode provides accurate sidewall roughness and profile measurement; reduces cross-sectioning |
| Automated Defect Review | Rapid defect characterization for wafers and photomasks; supports high-volume manufacturing |
| Placement Accuracy | ±250 nm raw image placement accuracy using high-resolution registration optics |
| System Compatibility | Fully compatible with KLARITY and most yield management systems |
| 3D Die Mapping & HyperMap™ | High-speed mapping (up to 36,000 µm/sec); full-field post-CMP inspection; automatic hotspot detection/rescan |
| CMP Advanced Process Control | Picometer sensitivity; 2 pm long-term repeatability; ideal for residual topography detection |
| Etch Depth Metrology | DTMode provides lowest TMU; <10 s MAM; optimized for HVM etch APC |
| Process Development (Etch & CMP) | XML/CAD recipe interface; recipes created in under 5 minutes; suitable for DOEs and process variants |
| Long-Range Scanning | Extended-range scanner with <1 nm out-of-plane error across 105 µm range |
| Large-Area Metrology | Supports measurements from tens of nm to 300 mm; ideal for CMP development |
| EUV Lithography APC | TrueSense™ supports non-destructive Top Line Roughness (LTR) monitoring correlated to yield |
| EUV Process Development | Non-destructive resist profiling; pico-Newton force control; sub-250 nm placement for hybrid metrology |
| Application Areas | CMP APC, Etch APC, NAND & Power Devices, Logic/Memory CMP, EUV lithography, EUV resist development |
| Target Users | Semiconductor process engineers, metrology teams, R&D groups, HVM fabs |
